JPH0365023B2 - - Google Patents

Info

Publication number
JPH0365023B2
JPH0365023B2 JP61051057A JP5105786A JPH0365023B2 JP H0365023 B2 JPH0365023 B2 JP H0365023B2 JP 61051057 A JP61051057 A JP 61051057A JP 5105786 A JP5105786 A JP 5105786A JP H0365023 B2 JPH0365023 B2 JP H0365023B2
Authority
JP
Japan
Prior art keywords
cladding layer
coining
boundary edge
inner lead
aluminum cladding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61051057A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62208654A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP61051057A priority Critical patent/JPS62208654A/ja
Priority to KR1019870000194A priority patent/KR900003874B1/ko
Publication of JPS62208654A publication Critical patent/JPS62208654A/ja
Publication of JPH0365023B2 publication Critical patent/JPH0365023B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/49—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP61051057A 1986-03-07 1986-03-07 リ−ドフレ−ム Granted JPS62208654A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP61051057A JPS62208654A (ja) 1986-03-07 1986-03-07 リ−ドフレ−ム
KR1019870000194A KR900003874B1 (ko) 1986-03-07 1987-01-13 리드프레임

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61051057A JPS62208654A (ja) 1986-03-07 1986-03-07 リ−ドフレ−ム

Publications (2)

Publication Number Publication Date
JPS62208654A JPS62208654A (ja) 1987-09-12
JPH0365023B2 true JPH0365023B2 (en]) 1991-10-09

Family

ID=12876176

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61051057A Granted JPS62208654A (ja) 1986-03-07 1986-03-07 リ−ドフレ−ム

Country Status (2)

Country Link
JP (1) JPS62208654A (en])
KR (1) KR900003874B1 (en])

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5437096A (en) * 1994-02-28 1995-08-01 Technical Materials, Inc. Method for making a multilayer metal leadframe
JPH0878604A (ja) * 1994-08-31 1996-03-22 Nec Corp 半導体装置用リードフレーム

Also Published As

Publication number Publication date
KR900003874B1 (ko) 1990-06-02
JPS62208654A (ja) 1987-09-12
KR870009465A (ko) 1987-10-26

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees